Chips
Tianshu GPU demonstrations pair inference hardware with agent-assisted software
An original QbitAI report published on October 29 describes Tianshu Zhixin's cloud and edge GPU demonstrations and its agent-assisted software stack.
Chips.
The hardware and infrastructure behind the next generation of AI.
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Chips
Rockchip reports nine-month profit growth as edge AI chips expand
Rockchip's third-quarter report, published on October 27, describes rising edge AI chip activity alongside supply constraints and forecasts for new products.
Chips
Cambricon says it never communicated million-chip shipment figure
Cambricon chairman Chen Tianshi said the company had never communicated a million-chip shipment figure, according to an October 26 report on its third-quarter results briefing.
Chips
Hygon's Xinghai plan puts application metrics at the center of chip adoption
An October 26 CBISMB analysis examines Hygon's Xinghai 2.0 initiative, announced October 22, and its emphasis on software collaboration, deployment and measurable business performance.
Chips
Sugon’s 100,000-Accelerator System Highlights Combined HPC and AI Workloads
An October 18 report describes a Shenzhen conference demonstration of a domestic computing system built to support both scientific simulation and AI workloads.
Chips
Fangzheng Microelectronics Sees AI Data Centers as a New Market for SiC Power Devices
Fangzheng Microelectronics executive Liu Ren says AI data-center power systems are becoming another growth area for its silicon-carbide devices alongside electric vehicles.
