THE CHIPS DESK

Chips.

The hardware and infrastructure behind the next generation of AI.

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Chips

Huawei Launches AIDC 1.0 Infrastructure Stack as China Pushes Compute-Energy Coordination

At Huawei Connect 2026, Huawei unveiled its AIDC 1.0 integrated infrastructure solution combining power supply, energy storage, thermal management and digital operations into a single stack aligned with China's national compute-energy coordination policy. The launch introduces new hardware including the Taishan UPS, Hengshan multi-voltage DC platform and SmartLi 5.0 storage, while signaling an industry shift toward Tokens Per Watt as the efficiency metric for AI data centers.

Chips

RoboTechnik Tests Silicon Photonics Manufacturing Pivot With Hong Kong Dual Listing

Suzhou-based RoboTechnik Intelligent Technology is set to begin trading H shares in Hong Kong on September 29, expecting approximately HK$4.96 billion in net proceeds after already listing on Shenzhen's ChiNext market. The IPO finances the company's transformation from photovoltaic automation equipment maker to silicon photonics assembly and test equipment supplier following its acquisition of Germany's ficonTEC. First-half 2026 results show a return to profitability and 144.8% revenue growth, but the listing tests whether Chinese precision manufacturing expertise can scale optical interconnect production for AI infrastructure.